Textbook in PDF format

This book focuses on the thermal reliability of power semiconductor device by looking at the failure mechanism, thermal parameters monitoring, junction temperature estimation, lifetime evaluation, and thermal management. Theoretical analysis and experimental tests are presented to explain existing reliability improvement techniques. This book is a valuable reference for the students and researchers who pay attention to the thermal reliability design of power semiconductor device. Introduction Thermal Fatigue Failure Mechanism of IGBT Module Thermal Model and Thermal Parameter Monitoring Junction Temperature Extraction of the Power Semiconductor Device Multi-time Scale Lifetime Evaluation of the Device in the Renewable Energy System Thermal Management Method and Optimization Prospect